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Hua Zhu Hai Zhang Tian-hao Zhang Shi-jin Yu Ping-chun Guo Yan-xiang Wang Zhi-sheng Yang 《Ceramics International》2021,47(12):16980-16985
Indium Tin Oxide (ITO) films were prepared, at room temperature, on a fluorphlogopite substrate using magnetron sputtering technology. At various temperatures of 500 °C, 600 °C, 700 °C, 800 °C, and 900 °C, the samples were (had) annealed for 2 h (a 2-h duration). The results showed improvement in the crystalline performance of ITO film at selected annealing temperatures, with a significant reduction in resistivity at 800 °C. The lowest resistivity is 4.08 × 10?4 Ω-cm, which is nearly an order of magnitude lower than the unannealed sample. All samples have an average light transmittance above 85% in the visible light range (400–800 nm), and with increasing annealing temperature, the average light transmittance tends to decrease. Besides, at the sensitive wavelength of 550 nm, the light transmittance is as high as 93.74%. The sheet resistance testing of the sample was through the number of bending times, which revealed that with the increase of the number of bending, the sheet resistance increases. However, after 1200 bending times, the change rate of the sheet resistance remains below 5%. Thus, the ITO film prepared on the flexible fluorphlogopite substrate revealed excellent optical and electrical properties, good flexibility, and improved stability after high-temperature annealing, which guarantees successful application in flexible electronic devices. 相似文献
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Rong Zhang Hailong Hu Hai Chen Siqi Li Cheng Ying Shuai Huang Qingting Liu Xudong Fu Shengfei Hu Ching-Ping Wong 《应用聚合物科学杂志》2020,137(39):49186
Recently, thermal interface materials (TIMs) are in great demands for modern electronics. For mechanically mixed polymer composite TIMs, the thermal conductivity and the mechanical properties are generally lower than expected values due to the sharply increased viscosity and poor filler dispersion. This work shows that addition of a small amount of polyester-based hyperbranched polymer (HBP) avoided the trade-off in mechanically mixed ABS/hexagonal boron nitride (h-BN) composites. After adding 0.5 wt% HBP, the maximum h-BN content in the composites increased from 50 to 60 wt%. The out-of-plane, in-plane thermal conductivity, and tensile strength of ABS/h-BN with 50 wt% h-BN were 0.408, 0.517 W/mK, and 18 MPa, respectively, and were increased to 0.729, 0.847 W/mK, and 32 MPa by adding 0.5 wt% HBP, while 0.972, 1.12 W/mK, and 29.5 MPa were achieved for ABS/h-BN/HBP with 60 wt% h-BN. The morphological and rheological results proved that these enhancements are due to the improved h-BN dispersion by decreasing viscosity of composites during mixing. Theoretical modeling based on the modified effective medium theory confirmed such results and showed that the interfacial thermal resistance also decreased slightly. Thus, this work demonstrates a facile and scalable method for simultaneously improving the thermal conductivity and mechanical properties of thermoplastic-based TIMs. 相似文献
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